According to Taiwanese publication DigiTimes Taiwan Semiconductor Manufacturing Company (TSMC) will begin manufacturing Touch ID fingerprint sensors for the next generation iPhone in Q2 this year.
This of course hints at a Q3 launch of the iPhone 6. From DigiTimes:
Taiwan Semiconductor Manufacturing Company (TSMC) reportedly will begin producing fingerprint sensors for Apple’s next-generation iPhone at its 12-inch fab using a 65nm process in the second quarter of 2014, according to industry sources.
TSMC has been fabricating the fingerprint sensors for iPhone 5s at its 8-inch fabs, while outsourcing the backend services to Xintec, China Wafer Level CSP and Advanced Semiconductor Engineering (ASE).
The publication notes that this time, TSMC will even handle the backend services in-house, rather than subcontracting it to ensure that yield rates are high, and no bottle necks are created in iPhone supplies. It also adds that after years of rumors, TSMC will finally start producing processors for Apple using its 20nm process.
The iPhone 6 is rumored to be released in two different sizes, anywhere between 4.7 inches to 6 inches, and will reportedly have a screen resolution of 1080p.
Apple usually follows an annual product cycle, so a Q3 launch is as per our expectations.