Semiconductor business Amkor Technology and STATISTICS ChipPAC will each manage 40 % of the packaging orders placed by Apple for its forthcoming A8 processor, while Advanced Semiconductor Engineering (ASE) will certainly obtain the remaining 20 % of the orders, baseding on a brand-new record from DigiTimes.
Apple’s A8 chip will certainly be a package-on-package (PoP) SoC option making up processors and mobile DRAM in a single package deal, stated the sources.
Taiwan Semiconductor Production Firm (TSMC) is likewise thought to have safeguarded wafer-bumping orders for the processor, and will supposedly start ramping up production of the A8 chip utilizing 20nm procedure innovation in the second quarter of 2014, with the processor largely expected to be utilized in Apple’s next-generation iPhone.
According to a record in September, it is additionally anticipated that Samsung will certainly assist with manufacturing of A8 chip, with the Oriental firm expected to deal with 20 % to 30 % of the manufacturing lots.
Overall, manufacturing prepare for the iPhone 6 seem to be tailoring up, with a report earlier this month specifying that TSMC would be generating finger print sensing units for the next-generation iPhone making use of a bigger 12-inch fab from the current 8-inch fab to boost manufacturing performance. It was also explained that TSMC would certainly deal with the product packaging process for the sensors itself instead of contracting bent on other companies in order to systematize control over the part.