3nm Mac and iPhone chips coming in 2023, Apple Silicon roadmap leaps ahead of Intel

Apple is taking the PC world by storm with its first debut of Apple Silicon chips inside of Macs, taking what it learned from developing A-series of chips and bringing that architecture to laptops and desktops.

Today, The Information said that Apple has no intent of slowing down and has plans for even faster second- and third-generation chips in the coming years.

The M1, M1 Pro and M1 Max are fabricated on a 5-nanometer process. The report says Apple will follow up with second-generation Apple Silicon chips in 2022, using an upgraded 5-nanometer process. Therefore, the performance and efficiency gains compared to the M1 generation will be relatively small. Apple plans for at least some of these chips to feature two dies.

Most notably, The Information says Apple and foundry partner TSMC plan to produce 3-nanometer chips for iPhones and Macs as soon as 2023. These could feature as many as four dies, with up to 40 CPU cores in total per chip. The three versions of the third-generation chip apparently are codenamed ‘Ibiza’, ‘Lobos’ and ‘Palma’.

The roadmap suggests that Apple will continue to “easily outperform Intel’s future processors for consumer PCs”.

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