KGI’s Ming-Chi Kuo has been at it again, with the prolific analyst today releasing a new report in which it is claimed that Apple’s 3D sensing technology is significantly ahead of technology available to Android devices using Qualcomm’s offering.
According to the report, Qualcomm will not be able to make significant shipments of its own 3D sensing technology until 2019, a long time after Apple’s introduction of the iPhone 8, which is expected to bring the tech to the mass market next month.
If Kuo’s belief is accurate, Qualcomm lacks the required advancements in both the hardware and software required to make 3D sensing technology work as well as is required. This, in turn, will have an impact on makers of Android phones, which would normally look to Qualcomm to provide such a solution. Xiaomi is the company believed to be considering using such technology but it is also said to be waiting to see how Apple’s implementation is received within the marketplace before committing to bringing similar functionality to its own devices.
KGI has previously reported that Apple’s use of a new camera and infrared sensing system will make for an incredible new 3D sensing technology that will give the iPhone 8 one of its marquee features. TSMC will be the company tasked with manufacturing Apple’s IR transmitter’s diffractive optical element and wafer-level optics while Qualcomm uses a 2-in-1 system of the DOE and WLO from Himax.
iPhone 8 concept render based on info provided by case maker Nodus
It is this that is believed to be the key difference causing Apple to be so far ahead of the game, and is something holding Qualcomm back as far as the 3D sensing technology is concerned.
Apple is expected t0 announce the iPhone 8, along with its new 3D capabilities next month. It remains to be seen whether it will be all it is claimed to be, but it is now only a matter of time before such questions can finally be answered.
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